3D integration: Applications and market trends

Abstract

3D integration using through-silicon-via (TSV) technology can bring several advantages over traditional integration techniques, such as System-on-Chip (SOC): shorter connections, increased interconnect density and bandwidth, lower power consumption and enhanced integration flexibility. Such advantages have already been shown for various products, from CMOS Image Sensors and MEMS devices in the consumer market, to FPGAs and more recently, memories for high-end applications. This paper will provide an overview of the different applications of 3D integration using TSV technology, including product announcements, reverse engineering and worldwide patent activities, highlighting the most active players and their activities.