{"title":"Integration of silicon circuit components onto plastic substrates using fluidic self-assembly","authors":"S.A. Stauth, B. Parviz","doi":"10.1109/ICMENS.2005.63","DOIUrl":null,"url":null,"abstract":"We demonstrate the use of fluidic self-assembly for the integration of microfabricated silicon components, including diffusion resistors and single crystal silicon field effect transistors, onto a clear, flexible plastic substrate. Preferential self-assembly of parts on a template is achieved with complementary shape recognition. The self-assembly process is driven in part by capillary forces resultant from a low melting point alloy re-flow. Our method allows for the integration of parts made via incompatible microfabrication processes onto a single platform. The self-assembly is performed in a single step providing both mechanical and electrical connection between substrate and silicon component.","PeriodicalId":185824,"journal":{"name":"2005 International Conference on MEMS,NANO and Smart Systems","volume":"65 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-07-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 International Conference on MEMS,NANO and Smart Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMENS.2005.63","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8
Abstract
We demonstrate the use of fluidic self-assembly for the integration of microfabricated silicon components, including diffusion resistors and single crystal silicon field effect transistors, onto a clear, flexible plastic substrate. Preferential self-assembly of parts on a template is achieved with complementary shape recognition. The self-assembly process is driven in part by capillary forces resultant from a low melting point alloy re-flow. Our method allows for the integration of parts made via incompatible microfabrication processes onto a single platform. The self-assembly is performed in a single step providing both mechanical and electrical connection between substrate and silicon component.