Further reduction of Schottky barrier height of Hf-germanide/n-Ge(001) contacts by forming epitaxial HfGe2

Kazuki Senga, S. Shibayama, M. Sakashita, S. Zaima, O. Nakatsuka
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引用次数: 2

Abstract

For realizing high-performance Ge-channel metal-oxide-semiconductor field-effect transistor (MOSFET), the reduction of parasitic resistance is one of the most important issues [1] . However, it is generally difficult to reduce the contact resistivity at metal/ n -Ge interface because of its high Schottky barrier height (SBH) around 0.5–0.6 eV, in which the Fermi level of the metal is pinned at the valence band edge of Ge; well-known Fermi level pinning (FLP) phenomenon [2] , [3] . One of the considerable reasons for FLP is disorder-induced gap states owing to dangling bonds at the metal/Ge interface [4] . There are some reports in which an epitaxial metal/Ge interface alleviates FLP and the SBH can be lowered with Fe 3 Si/ n -Ge(111) [5] , Mn 3 Ge 5 / n -Ge(111) [6] , and NiGe/ n -Ge(110) contacts [7] .
通过形成外延HfGe2进一步降低Hf-germanide/n-Ge(001)触点的Schottky势垒高度
为了实现高性能的ge沟道金属氧化物半导体场效应晶体管(MOSFET),降低寄生电阻是最重要的问题之一[1]。然而,由于金属/ n -Ge界面的肖特基势垒高度(SBH)在0.5 ~ 0.6 eV左右,金属的费米能级被钉住在Ge的价带边缘,因此通常难以降低金属/ n -Ge界面的接触电阻率;众所周知的费米能级钉住现象[2],[3]。FLP的一个重要原因是由于金属/锗界面上的悬空键引起的无序间隙状态[4]。有一些报道称外延金属/Ge界面可以缓解FLP, Fe 3si / n -Ge(111) [5], Mn 3ge 5 / n -Ge(111)[6]和nge / n -Ge(110)接触可以降低SBH[7]。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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