Thermomechanical Characterization Of Flip Chip Solder Bumps For Multichip Module Applications

J. Lau
{"title":"Thermomechanical Characterization Of Flip Chip Solder Bumps For Multichip Module Applications","authors":"J. Lau","doi":"10.1109/IEMT.1992.639907","DOIUrl":null,"url":null,"abstract":"In this paper, the responses of a self-stretching flip chip solder joint under thermal fatigue crack propagation have been study. Emphasis is placed on the determination of the J-integral and stress intensity factor around the crack tips of the solder joint by the finite element method. A 5th order polynomial has been used to best fit the J-integral and stress intensity factor as a function of the crack length in the solder joint. Thermal fatigue life of the solder joint was then estimated based on the calculated stress intensity factor, Paris' law, and fatigue crack growth rate data on solders. Furthermore, a correlation between the analytical and experimental results has also been made.","PeriodicalId":403090,"journal":{"name":"Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium","volume":"10872 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1992.639907","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

In this paper, the responses of a self-stretching flip chip solder joint under thermal fatigue crack propagation have been study. Emphasis is placed on the determination of the J-integral and stress intensity factor around the crack tips of the solder joint by the finite element method. A 5th order polynomial has been used to best fit the J-integral and stress intensity factor as a function of the crack length in the solder joint. Thermal fatigue life of the solder joint was then estimated based on the calculated stress intensity factor, Paris' law, and fatigue crack growth rate data on solders. Furthermore, a correlation between the analytical and experimental results has also been made.
用于多芯片模块应用的倒装芯片焊料凸点的热力学特性
本文研究了自拉伸倒装片焊点在热疲劳裂纹扩展下的响应。重点讨论了用有限元法确定焊点裂纹尖端周围的j积分和应力强度因子。采用5阶多项式来拟合j积分和应力强度因子作为焊点裂纹长度的函数。然后根据计算的应力强度因子、Paris定律和焊点的疲劳裂纹扩展速率数据估计焊点的热疲劳寿命。此外,还对分析结果和实验结果进行了对比。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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