{"title":"A two-stage cascode class F CMOS power amplifier for Bluetooth","authors":"Guo-Ming Sung, Xiang-jun Zhang, T. Hsiao","doi":"10.1109/ICASID.2012.6325305","DOIUrl":null,"url":null,"abstract":"In this paper, a two-stage cascode class F power amplifier (PA) intended for class 1 Bluetooth application is presented using standard 0.18-μm CMOS technology. In the proposed PA, a cascode schematic is used not only to avoid from overflow current but also to have a good isolation. Furthermore, the class F power amplifier is designed to improve the power efficiency using the operating mode in either triode or cut-off region. The simulation results present that the output power is larger than 20 dBm and the power added efficiency (PAE) is roughly 49%. Moreover, the multiple bonding wires are added to eliminate the parasitic capacitance of input stage (first) and to save the power dissipation.","PeriodicalId":408223,"journal":{"name":"Anti-counterfeiting, Security, and Identification","volume":"2012 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-10-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Anti-counterfeiting, Security, and Identification","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICASID.2012.6325305","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
In this paper, a two-stage cascode class F power amplifier (PA) intended for class 1 Bluetooth application is presented using standard 0.18-μm CMOS technology. In the proposed PA, a cascode schematic is used not only to avoid from overflow current but also to have a good isolation. Furthermore, the class F power amplifier is designed to improve the power efficiency using the operating mode in either triode or cut-off region. The simulation results present that the output power is larger than 20 dBm and the power added efficiency (PAE) is roughly 49%. Moreover, the multiple bonding wires are added to eliminate the parasitic capacitance of input stage (first) and to save the power dissipation.