Ball Grid Array Ceramic Packages

Abstract

With the advent of greater density assembly, increased i/o connections and higher power dissipation requirements, a new method of producing cost effective high pin count packages is being demonstrated. Ball grid array packages have been around for several years, both in ceramic and laminate technologies and are now being accepted as a viable packaging alternative. This discussion will describe a low cost method to combine ceramic multichip module technology with ball grid array assembly. The methods are unique in the placement of the solder spheres, the almost spherical dimensions of the connections and the extreme ruggedness of the resulting package. The improved thermal characteristics, ease of assembly and low cost will make this packaging technique a practical solution for todays demands.