Base thickness and high frequency performance of SiGe HBTs

A. Gruhle, H. Kibbel, U. Erben, E. Kasper
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引用次数: 3

Abstract

Summary form only given. The influence of the base thickness on the high-frequency performance of about 20 fabricated HBTs (heterojunction bipolar transistors) has been analyzed by plotting the highest obtained f/sub T/ value against base thickness. Base thickness is defined as the distance between the two Si/SiGe interfaces which usually coincide with the metallurgical pn-junctions. A steady increase of f/sub T/ with decreasing base thickness can be clearly seen: starting from the first published HBTs with 50 nm base thickness which did not exceed 20 GHz, transistors with 40 nm base had 37-52 GHz and devices with 28-30 nm bases exhibited 58-91 GHz. The latest two samples had only 25 and 22 nm base thicknesses, leading to an f/sub T/ of 95 GHz (f/sub max/=50 GHz), the highest value reported for Si transistors. The base doping in the latter sample was 8*10/sup 19/ cm/sup -3/ to maintain a base sheet resistance of about 1.2 k Omega . >
SiGe HBTs基材厚度与高频性能
只提供摘要形式。通过绘制得到的最高f/sub T/值与基极厚度的关系图,分析了基极厚度对20个异质结双极晶体管高频性能的影响。基底厚度定义为两个Si/SiGe界面之间的距离,这两个界面通常与冶金pn结重合。f/sub T/随基板厚度的减小而稳步增加:从首次发表的50 nm基板厚度不超过20 GHz的hbt开始,40 nm基板的晶体管的频率为37-52 GHz, 28-30 nm基板的器件的频率为58-91 GHz。最新的两个样品只有25纳米和22纳米的基材厚度,导致f/sub T/为95 GHz (f/sub max/=50 GHz),这是硅晶体管的最高值。后一种样品的基片掺杂量为8*10/sup 19/ cm/sup -3/,基片电阻保持在1.2 k ω左右。>
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