{"title":"Modeling of through-silicon via's (TSV) with a 3D planar integral equation solver","authors":"J. Sercu, T. Schwartzmann","doi":"10.1109/NEMO.2014.6995659","DOIUrl":null,"url":null,"abstract":"Through-silicon via (TSV) interconnection technology is seen as a key enabling technology for stacking silicon dies and building 3D chips. In this paper, we present a novel technique to enable the modeling of through-silicon via interconnects within a 3D planar integral equation solver. The technique is capable of modeling both the dielectric isolation effects of the TSV oxide and the metal-oxide-semiconductor (MOS) depletion effects at the TSV oxide - silicon bulk contact regions.","PeriodicalId":273349,"journal":{"name":"2014 International Conference on Numerical Electromagnetic Modeling and Optimization for RF, Microwave, and Terahertz Applications (NEMO)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-05-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 International Conference on Numerical Electromagnetic Modeling and Optimization for RF, Microwave, and Terahertz Applications (NEMO)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/NEMO.2014.6995659","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Through-silicon via (TSV) interconnection technology is seen as a key enabling technology for stacking silicon dies and building 3D chips. In this paper, we present a novel technique to enable the modeling of through-silicon via interconnects within a 3D planar integral equation solver. The technique is capable of modeling both the dielectric isolation effects of the TSV oxide and the metal-oxide-semiconductor (MOS) depletion effects at the TSV oxide - silicon bulk contact regions.