Numerical simulation of GaN HEMTs with local doping barrier layer

Wenli Fu, Yuehang Xu, B. Yan, Yunchuan Guo, R. Xu
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Abstract

GaN HEMT with local doping barrier layer is proposed in this paper. The DC and RF characteristics are analyzed by using 2D numerical simulation. The results show that the breakdown voltage is 25% larger than that of the conventional structure due to the extension of depleted layer width between gate and drain electrodes. A theoretical maximum output power density of 14.6W/mm has been achieved, which is ~34% larger than conventional structure. And the RF simulation results show that the proposed GaN HEMT also improved the maximum stable gain by 1dB up to 70GHz due to the decrease of the gate-drain capacitance.
具有局部掺杂势垒层的GaN hemt的数值模拟
本文提出了具有局部掺杂势垒层的GaN HEMT。通过二维数值模拟,分析了其直流和射频特性。结果表明,由于栅极和漏极之间耗尽层宽度的扩大,该结构的击穿电压比传统结构的击穿电压高25%。理论最大输出功率密度达到14.6W/mm,比传统结构大34%。射频仿真结果表明,由于栅极-漏极电容的减小,GaN HEMT在70GHz时的最大稳定增益提高了1dB。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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