Nanoscale Conductivity Mapping: Live Imaging of Dielectric Breakdown with STEM EBIC

W. Hubbard, J. Lodico, H. Chan, M. Mecklenburg, B. Regan
{"title":"Nanoscale Conductivity Mapping: Live Imaging of Dielectric Breakdown with STEM EBIC","authors":"W. Hubbard, J. Lodico, H. Chan, M. Mecklenburg, B. Regan","doi":"10.1109/IPFA55383.2022.9915733","DOIUrl":null,"url":null,"abstract":"Dielectric breakdown (DB) is central to the failure and function of modern and next-generation computing components. Despite its importance in microelectronics, the specific mechanisms leading to DB are poorly understood. Electrical testing provides little spatial information about the small-scale effects that precede breakdown. High resolution imaging techniques, such as transmission electron microscopy (TEM), have the requisite resolution but are almost exclusively used to study the post-mortem effects of catastrophic DB. In this study we present techniques to directly visualize DB in nanoscale devices with scanning TEM electron beam-induced current (STEM EBIC) imaging. STEM EBIC imaging maps local conductivity and electric field with high contrast. In HfO2-based resistive memory (RRAM) devices, a data bit is stored as a conductive path formed via controlled, reversible DB. With STEM EBIC we image Ti/HfO2/Pt devices capable of switching repeatedly in situ. Distinct regions of soft and hard dielectric breakdown are observed at different phases of RRAM cycling. These results suggest a model where DB occurs on a progressive continuum between hard and soft breakdown.","PeriodicalId":378702,"journal":{"name":"2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"73 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-07-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA55383.2022.9915733","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

Dielectric breakdown (DB) is central to the failure and function of modern and next-generation computing components. Despite its importance in microelectronics, the specific mechanisms leading to DB are poorly understood. Electrical testing provides little spatial information about the small-scale effects that precede breakdown. High resolution imaging techniques, such as transmission electron microscopy (TEM), have the requisite resolution but are almost exclusively used to study the post-mortem effects of catastrophic DB. In this study we present techniques to directly visualize DB in nanoscale devices with scanning TEM electron beam-induced current (STEM EBIC) imaging. STEM EBIC imaging maps local conductivity and electric field with high contrast. In HfO2-based resistive memory (RRAM) devices, a data bit is stored as a conductive path formed via controlled, reversible DB. With STEM EBIC we image Ti/HfO2/Pt devices capable of switching repeatedly in situ. Distinct regions of soft and hard dielectric breakdown are observed at different phases of RRAM cycling. These results suggest a model where DB occurs on a progressive continuum between hard and soft breakdown.
纳米尺度电导率映射:电介质击穿的实时成像与STEM EBIC
介质击穿(DB)是现代和下一代计算组件故障和功能的核心。尽管它在微电子学中很重要,但导致DB的具体机制却知之甚少。关于击穿前的小规模效应,电测试提供的空间信息很少。高分辨率成像技术,如透射电子显微镜(TEM),具有必要的分辨率,但几乎专门用于研究灾难性DB的死后影响。在这项研究中,我们提出了用扫描透射电镜电子束感应电流(STEM EBIC)成像直接显示纳米级器件中DB的技术。STEM EBIC成像以高对比度绘制局部电导率和电场。在基于hfo2的电阻存储器(RRAM)器件中,数据位被存储为通过受控可逆DB形成的导电路径。利用STEM EBIC,我们成像了能够在原位重复切换的Ti/HfO2/Pt器件。在RRAM循环的不同阶段观察到不同的软、硬介质击穿区域。这些结果表明,DB发生在硬击穿和软击穿之间的渐进连续体中。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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