Schottky diodes in CMOS for terahertz circuits and systems

Yaming Zhang, R. Han, Youngwan Kim, D. Kim, H. Shichijo, S. Sankaran, C. Mao, E. Seok, D. Shim, K. O. Kenneth
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引用次数: 5

Abstract

Using Polysilicon Gate Separated Schottky Diode structures that can be fabricated without any process modifications in a foundry digital 130-nm CMOS process, cut-off frequency of ~2 THz has been measured. In addition, exploiting the complementary of CMOS technology, an anti-parallel diode pair with cut-off frequency of ~660 GHz consisting of an n-type and a p-type Schottky diode has been demonstrated in the same 130-nm CMOS process. Using the diodes, a frequency doubler and a tripler have been demonstrated. Additionally, the diodes have been utilized to implement 280-GHz and 860-GHz detectors for imaging. A fully-integrated 280-GHz 4×4 imager array exhibits measured NEP of 29pW/Hz½ and responsivity of 5.1kV/W (323V/W without the amplifier). The 860-GHz detector without an amplifier achieves responsivity of 355V/W and NEP of 32pW/Hz½. The NEP at 860GHz is 2X better than the best reported performance of MOSFET-based imagers without a silicon lens attached to the chip.
用于太赫兹电路和系统的CMOS肖特基二极管
利用多晶硅栅极分离肖特基二极管结构,在不需要任何工艺修改的情况下,在铸造数字130纳米CMOS工艺中,测量了~2 THz的截止频率。此外,利用CMOS技术的互补,在相同的130纳米CMOS工艺中,演示了由n型和p型肖特基二极管组成的截止频率为~660 GHz的反并联二极管对。利用二极管,一个倍频器和三倍频器已被证明。此外,二极管已用于实现280 ghz和860 ghz的成像探测器。完全集成的280 ghz 4×4成像仪阵列的NEP测量值为29pW/Hz½,响应度为5.1kV/W(不带放大器时为323V/W)。不带放大器的860-GHz探测器的响应率为355V/W, NEP为32pW/Hz½。860GHz的NEP比没有硅透镜连接芯片的基于mosfet的成像仪的最佳性能要好2倍。
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