Ammonia (NH/sub 3/) plasma surface passivation of InP/InGaAs heterojunction bipolar transistors

Hong Wang, G. Ng, Hong Yang, K. Radhakrishnan
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引用次数: 3

Abstract

In this study, we report on the experimental results of ammonia (NH/sub 3/) plasma surface passivation of InP/InGaAs HBT's. The NH/sub 3/ plasma treatment is found to reduce the surface recombination and thus improve the current gain. The passivation mechanism is believed to be similar to that of H and N plasma treatment for GaAs HBT's.
氨(NH/sub 3/)等离子体表面钝化InP/InGaAs异质结双极晶体管
本文报道了氨(NH/sub 3/)等离子体表面钝化InP/InGaAs HBT的实验结果。发现NH/sub - 3/等离子体处理可以减少表面复合,从而提高电流增益。该钝化机制与氢氮等离子体处理砷化镓HBT的钝化机制相似。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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