Detection of Failure Analysis Methods with Image Classification

Selene Lobnig, C. Burmer, Konstantin Schekotihin
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Abstract

Failure analysis (FA) in semiconductors is an error-prone and knowledge-intensive activity. Therefore, timely support of engineers with information about past analyses, best practices, or technical data is crucial for successful FA operations. Unfortunately, in many cases application of modern Artificial Intelligence (AI) methods is limited since most of the data is stored in human-readable formats only, thus, making its automatic processing impossible. In this paper, we consider a problem of method detection from images made by different tools used in FA. We show that the proposed deep learning technique can successfully recognize methods from various images made in an FA lab with an accuracy of 91%. In addition, we investigate the transferability of our results to images of other labs. Obtained results show a slight drop in accuracy to 82%, which can be improved by fine-tuning a model on data from other labs.
基于图像分类的故障检测分析方法
半导体失效分析是一项容易出错的知识密集型工作。因此,及时向工程师提供有关过去分析、最佳实践或技术数据的信息,对于FA操作的成功至关重要。不幸的是,在许多情况下,现代人工智能(AI)方法的应用是有限的,因为大多数数据仅以人类可读的格式存储,因此,使其无法自动处理。在本文中,我们考虑了一个方法检测的问题,从不同的工具在图像中使用的FA。我们表明,所提出的深度学习技术可以成功地从FA实验室制作的各种图像中识别方法,准确率为91%。此外,我们调查我们的结果转移到其他实验室的图像。获得的结果表明,准确度略有下降至82%,可以通过对其他实验室数据的模型进行微调来提高。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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