T. Schulz, W. Xiong, C. Cleavelin, K. Schruefer, M. Gostkowski, K. Matthews, G. Gebara, R. J. Zaman, P. Patruno, A. Chaudhry, A. Woo, J. Colinge
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引用次数: 15
Abstract
Fin thickness non-uniformity is a potential shortcoming of vertical multiple-gate devices such as FinFETs and tri-gate FETs. In this paper a test structure with intentionally misaligned gates is used to investigate the sensitivity of electrical characteristics on fin thickness variations.