Signal integrity design of bump-less interconnection for high-speed signaling in 2.5D and 3D IC

Hyunsuk Lee, Heegon Kim, Sumin Choi, Dong-Hyun Kim, Kyungjun Cho, Joungho Kim
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引用次数: 1

Abstract

With the advent of 2.5D and 3D IC, micro bumps has been highlighted as the core technology for realization of 2.5D and 3D IC. However, due to the difficulties about fabrication of reliable and cost-effective micro bumps, resulting in decrease in the final chip yield. In this paper, we propose a bump-less interconnection for high-speed signaling in 2.5D and 3D IC. In the proposed interconnection, high speed signal is transmitted via coupling pads instead of micro bumps. Signal integrity of the proposed interconnection is analyzed by simulation in the frequency- and time-domain. For a more detailed analysis, the proposed interconnection and the interconnection with the micro bumps are compared. In addition, because the silicon, organic and glass interposer have been widely employed for the 2.5D and 3D IC packaging, signal integrity of the proposed interconnection on three types of the interposer is compared and analyzed.
2.5D和3D IC中高速信令无碰撞互连的信号完整性设计
随着2.5D和3D集成电路的出现,微凸点已成为实现2.5D和3D集成电路的核心技术,但由于难以制造可靠且具有成本效益的微凸点,导致最终芯片良率下降。在本文中,我们提出了一种用于2.5D和3D IC中高速信号的无碰撞互连。在所提出的互连中,高速信号通过耦合垫而不是微碰撞传输。通过频域和时域仿真分析了所提互连的信号完整性。为了进行更详细的分析,将所提出的互连与带有微凸起的互连进行了比较。此外,由于硅、有机和玻璃中间层已广泛应用于2.5D和3D IC封装,因此对三种中间层上所提出的互连信号完整性进行了比较和分析。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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