Technology and design of SIPOS films used as field plates for high voltage planar devices

D. Jaume, G. Charitat, A. Peyre-Lavigne, P. Rossel
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引用次数: 2

Abstract

In order to improve the voltage handling capability of high voltage and power devices, an efficient technique based on the deposition of a semi-resistive layer acting as a field plate is proposed. The complete design of a high voltage planar transistor (1500V) using a SIPOS layer on SiO2 film is extracted from bidimensional numerical simulations. The evolution of breakdown voltage BVcbo versus critical parameters as oxide thickness, field plate length and field plate-stop channel distance is calculated. A good agreement between theoretical and experimental results is obtained. The breakdown voltage achieved by the devices is near 90% of the ideal planar breakdown voltage without any damage for other electrical parameters.
SIPOS薄膜作为高压平面器件场极板的工艺与设计
为了提高高压和功率器件的电压处理能力,提出了一种基于半电阻层作为场极板的沉积技术。通过二维数值模拟得到了SIPOS层在SiO2薄膜上的高压平面晶体管(1500V)的完整设计。计算了击穿电压BVcbo随氧化层厚度、场极板长度和场极板停止通道距离等关键参数的变化规律。理论与实验结果吻合较好。该器件实现的击穿电压接近理想平面击穿电压的90%,而对其他电气参数没有任何损害。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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