D. Jaume, G. Charitat, A. Peyre-Lavigne, P. Rossel
{"title":"Technology and design of SIPOS films used as field plates for high voltage planar devices","authors":"D. Jaume, G. Charitat, A. Peyre-Lavigne, P. Rossel","doi":"10.1117/12.26298","DOIUrl":null,"url":null,"abstract":"In order to improve the voltage handling capability of high voltage and power devices, an efficient technique based on the deposition of a semi-resistive layer acting as a field plate is proposed. The complete design of a high voltage planar transistor (1500V) using a SIPOS layer on SiO2 film is extracted from bidimensional numerical simulations. The evolution of breakdown voltage BVcbo versus critical parameters as oxide thickness, field plate length and field plate-stop channel distance is calculated. A good agreement between theoretical and experimental results is obtained. The breakdown voltage achieved by the devices is near 90% of the ideal planar breakdown voltage without any damage for other electrical parameters.","PeriodicalId":334101,"journal":{"name":"ESSDERC '90: 20th European Solid State Device Research Conference","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ESSDERC '90: 20th European Solid State Device Research Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.26298","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
In order to improve the voltage handling capability of high voltage and power devices, an efficient technique based on the deposition of a semi-resistive layer acting as a field plate is proposed. The complete design of a high voltage planar transistor (1500V) using a SIPOS layer on SiO2 film is extracted from bidimensional numerical simulations. The evolution of breakdown voltage BVcbo versus critical parameters as oxide thickness, field plate length and field plate-stop channel distance is calculated. A good agreement between theoretical and experimental results is obtained. The breakdown voltage achieved by the devices is near 90% of the ideal planar breakdown voltage without any damage for other electrical parameters.