Secure, Scalable and Low-Power Junction Temperature Sensing for Multi-Processor Systems-on-Chip

G. A. Kumar
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引用次数: 1

Abstract

The measurement of silicon junction temperature is often required in embedded applications for monitoring and control, device protection and different types of temperature based compensation. The systems-on-chip (SoC) are growing complex these days with multiple processors and high degree of peripheral integration. Also the power consumption of the SoC requires being very low for battery operated or energy harvesting based embedded applications like Internet of Things (IoT). This paper describes the architecture, integration, programming model and working scheme of a silicon junction temperature sensing module that achieves security, scalability and low-power requirements for multi-processor SoCs.
用于多处理器片上系统的安全、可扩展和低功耗结温传感
在监测和控制、设备保护和不同类型的基于温度的补偿的嵌入式应用中,经常需要测量硅结温度。如今,片上系统(SoC)越来越复杂,有多个处理器和高度外围集成。此外,SoC的功耗要求非常低,用于电池供电或基于物联网(IoT)等嵌入式应用的能量收集。介绍了一种满足多处理器soc安全性、可扩展性和低功耗要求的硅结温度传感模块的体系结构、集成、编程模型和工作方案。
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