The diffusion of Ag in GaN-based surface plasmon light-emitting diodes under different temperature annealing

Lei Liu, Lixia Zhao, Zhiguo Yu, Jun-xi Wang, Y. Zeng, Jin-min Li
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引用次数: 1

Abstract

In order to achieve effective coupling between the surface plasmon and the quantum wells (QWs) for surface plasmon LEDs, metal-embedded or thin p-GaN layer approach have been normally been used, but by taking either of these methods, the enhancement of the IQE of the fabricated SP-LEDs is not remarkable, in some cases, the internal quantum efficiency even decreases. Here, this study is to clarify the origin and understand what kind of influence of temperature treatment to the LED structure. GaN based LEDs with Ag from the same epitaxial wafer were annealed under different temperatures to imitate the high temperature treatment during the SP-LED fabrication. The results show that the diffusion of Ag into the quantum wells could be one of the reasons and in order to realize SP-LEDs with high IQE, high temperature treatments need to be avoided to prevent the diffusion of metal.
不同退火温度下银在氮化镓基表面等离子体发光二极管中的扩散
为了实现表面等离子体led表面等离子体与量子阱的有效耦合,通常采用金属嵌入或薄p-GaN层方法,但无论采用哪一种方法,所制备的sp - led的IQE都没有显著提高,在某些情况下,内部量子效率甚至降低。在此,本研究旨在厘清其起源,了解温度处理对LED结构有怎样的影响。利用同一外延片上的Ag对GaN基led进行不同温度退火,模拟SP-LED制造过程中的高温处理。结果表明,银在量子阱中的扩散可能是原因之一,为了实现高IQE的sp - led,需要避免高温处理以防止金属的扩散。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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