{"title":"Analysis: Let's stick together","authors":"C. Edwards","doi":"10.1049/ESS:20070405","DOIUrl":null,"url":null,"abstract":"Until recently, CMOS and RF looked as though they would follow separate paths when it came to chip design. Chris Edwards looks at how teams are now looking seriously at combining them on the latest wave of digital silicon processes.","PeriodicalId":132835,"journal":{"name":"Electronic Systems and Software","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electronic Systems and Software","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1049/ESS:20070405","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Until recently, CMOS and RF looked as though they would follow separate paths when it came to chip design. Chris Edwards looks at how teams are now looking seriously at combining them on the latest wave of digital silicon processes.