Alkali Silicate Glass based thermal coatings

Abstract

This paper describes a family of composite materials that are based on Alkali Silicate Glass (ASG), which can be processed and cured at temperatures that are compatible with conventional electronics packaging processes. The focus of this paper is on ASG composite materials with high thermal conductivity filler materials for use as thermal encapsulants and adhesives in electronics packaging. Data are presented for testing on a thermal test die encapsulated with an ASG-diamond composite as well as an evaluation of using the material to adhere an inductor coil to a circuit board. These results indicated that the thermal conductivity of the material exceeded 10 W/mK and it remained robust after 1000 thermal shocks.