1Mbit 1T1C 3D DRAM with Monolithically Stacked One Planar FET and Two Vertical FET Heterogeneous Oxide Semiconductor layers over Si CMOS

Y. Okamoto, Y. Komura, T. Mizuguchi, T. Saito, M. Ito, K. Kimura, T. Onuki, Y. Ando, H. Sawai, T. Murakawa, H. Kunitake, T. Matsuzaki, H. Kimura, M. Fujita, M. Ikeda, S. Yamazaki
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Abstract

We have formed heterogeneous oxide semiconductor FETs (OSFETs) in one planar FET layer and two vertical FET (VFET) layers over Si by monolithically stacking OSFETs on top of Si CMOS. Formation of IOSIC DRAM memory cells in the VFET layers and a primary sense amplifier (1st SA) in the planar FET layer has realized a memory with different functions such as memory switching and signal amplification in different layers for the first time. As a result, special features, which are three-dimensional monolithic stacking of memory and long date retention, are implemented.
在Si CMOS上单片堆叠一个平面FET和两个垂直FET非均质氧化半导体层的1mb1t1c 3D DRAM
我们通过在Si CMOS上单片堆叠osfet,在一个平面FET层和两个垂直FET层上形成了非均质氧化半导体FET (osfet)。在VFET层中形成IOSIC DRAM存储单元,在平面FET层中形成初级感测放大器(1st SA),首次实现了在不同层中具有不同功能的存储器,如存储器开关和信号放大。因此,实现了三维单片内存堆叠和长日期保留的特殊功能。
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