Exploration of tile/triangle-based rendering approaches for 3D graphics SoC

Chi-Tsai Yeh, Ching-Yuan Lin, W. Chiou, Ing-Jer Huang
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Abstract

Three dimension (3D) graphics applications have been widely used in handheld devices which are an inevitable tendency in the future. In this paper, we model a complex 3D graphics SoC hardware by using SystemC and run some testbenches on this platform. For speeding up the simulation time, we adopt Transaction Level Model (TLM) and implement two type of rendering approaches, tile-based and triangle-based, to find out the optimal architecture. According to experimental results, triangle-based rendering is 9–24% faster than tile-based rendering in smaller objects. Considering the energy consumption, the number of memory access of the former is 6–43% less than the latter.
探索基于贴图/三角形的3D图形SoC渲染方法
三维图形技术在手持设备中的广泛应用是未来发展的必然趋势。本文利用SystemC对一个复杂的三维图形SoC硬件进行了建模,并在该平台上运行了一些测试平台。为了加快仿真速度,我们采用事务级模型(Transaction Level Model, TLM),并实现了基于tile和基于三角形的两种渲染方法来寻找最优的架构。根据实验结果,在较小的物体上,基于三角形的渲染比基于瓷砖的渲染快9-24%。考虑到能耗,前者的内存访问次数比后者少6-43%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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