Tin plating investigation as a potential alternate to silver plating in plug in connection for low voltage low amp miniature circuit breakers

M. Muñoz, Hai-Ching Chen, J. Hernández
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引用次数: 2

Abstract

This paper reports the investigation of tin plating as a potential alternate to silver plating on plug in line terminal connections for low voltage low amp miniature circuit breakers. The plug in line terminals are typically connected on the enclosure interior bus bars and clamped with a spring clip. The substrate material of the line terminal was a copper alloy. The line terminals with both, tin and silver plating, were investigated on tin plated aluminum and bare copper bus bars. The connections were examined by cycling 50 Amps ac, one hour on and one hour off for 2,100 cycles in an ambient temperature of 25°C. The examined parameters were bulk temperature and voltage drop. SEM observations have been made for both, tin and silver plating, after the current cycling. Additionally, the plating deterioration on the contact spots was measured for oxygen and copper contents by EDX analysis. The analysis results indicated much higher contents of oxygen and copper on the tin plated connectors than the silver plated connectors which is consistent with the connector plating deterioration and fretting that was observed with the SEM.
低电压、低安培微型断路器插拔连接中镀锡替代镀银的可能性研究
本文报道了在低压低安培微型断路器插拔端子连接上镀锡作为镀银的潜在替代品的研究。插入式接线端子通常连接在机箱内部母线上,并用弹簧夹紧。线路端子的衬底材料为铜合金。在镀锡铝和裸铜母线上研究了镀锡和镀银的线路端子。在25°C的环境温度下,通过50安培交流电,一小时开一小时关,2100次循环来检查连接。检测参数为体温和压降。在电流循环后,对镀锡和镀银进行了扫描电镜观察。此外,通过EDX分析测定了接触点的镀损情况。分析结果表明,镀锡连接器上的氧和铜含量远高于镀银连接器,这与扫描电镜观察到的连接器镀层劣化和微动一致。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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