{"title":"Temperature analysis for modeled saw tooth flexure micro gripper with constant heat flux boundary conditions","authors":"C. A. Kumar, M. Goutham","doi":"10.1109/SMARTTECHCON.2017.8358410","DOIUrl":null,"url":null,"abstract":"This paper presents modeling simulation and temperature analysis on micro-gripper with constant heat flux applied. Half part of the device is designed as it is symmetric in geometry. Electric potential applied, at its anchors will cause displacement of the material. The application of displacement is used in biomedical application. The displacement, Electric current conduction, caused heat generation and change in structure due to stress and strain takes place. Finite Element analysis is carried out to verify the design and temperature analysis is done.","PeriodicalId":312752,"journal":{"name":"2017 International Conference On Smart Technologies For Smart Nation (SmartTechCon)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 International Conference On Smart Technologies For Smart Nation (SmartTechCon)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMARTTECHCON.2017.8358410","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper presents modeling simulation and temperature analysis on micro-gripper with constant heat flux applied. Half part of the device is designed as it is symmetric in geometry. Electric potential applied, at its anchors will cause displacement of the material. The application of displacement is used in biomedical application. The displacement, Electric current conduction, caused heat generation and change in structure due to stress and strain takes place. Finite Element analysis is carried out to verify the design and temperature analysis is done.