Modeling and measurement of the Alpha 21364 package

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI:10.1109/EPEP.2001.967664

M. Tsuk, R. Dame, D. Dvorscak, C. Houghton, J. Laurent

引用次数: 9

Abstract

The latest generation Alpha microprocessor, the 21364, uses a ceramic LGA package with mesh power and ground planes. Electromagnetic modeling and measurements were used to verify the validity of the design of the package, and to suggest improvements to the layout to minimize crosstalk.

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Alpha 21364封装的建模和测量

最新一代Alpha微处理器21364采用具有网格电源和接地面的陶瓷LGA封装。利用电磁建模和测量验证了封装设计的有效性，并提出了改进布局的建议，以最大限度地减少串扰。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

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