Novel oxygen showering process (OSP) for extreme damage suppression of sub-20nm high density p-MTJ array without IBE treatment

J. Jeong, T. Endoh
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引用次数: 6

Abstract

A novel damage recovery scheme using the oxygen showering post-treatment (OSP) is proposed to recover patterning damages and to improve electric and magnetic properties of p-MTJs, and its array yield. By applying our OSP to 25nm p-MTJs cell array, the MR was increased from 99% to 116% and the Isw was decreased from 41.1uA to 28.7uA. Moreover, electric short fails of MTJs array due to metallic by-products reduced dramatically by the selective oxidation of the damaged layer and its isolation from damage-less area. The OSP process makes the switching efficiency of 25nm patterned MTJs to be improved more than 30% compared with IBE treatment process. The mechanism of this enhancement is that spin directions of damaged area is changed from perpendicular to in-plane and, by this change, the energy barrier of damaged area is reduced. By the OSP treatment, we could develop the robust patterning process for sub-20nm STT-MRAM.
新型氧淋浴工艺(OSP)用于抑制亚20nm高密度p-MTJ阵列的极端损伤,无需IBE处理
提出了一种新的损伤修复方案,利用氧淋浴后处理(OSP)修复图案损伤,提高p-MTJs的电、磁性能和阵列产率。将我们的OSP应用于25nm的p-MTJs细胞阵列,MR从99%提高到116%,Isw从41.1uA降低到28.7uA。此外,由于损伤层的选择性氧化及其与无损伤区域的隔离,金属副产物引起的MTJs阵列电短失效大大减少。与IBE处理工艺相比,OSP工艺使25nm MTJs的开关效率提高了30%以上。这种增强的机理是损伤区域的自旋方向由垂直方向改变为面内方向,从而降低了损伤区域的能垒。通过OSP处理,我们可以开发出20nm以下STT-MRAM的鲁棒图像化过程。
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