A Hybrid Supply Modulator with Envelop Tracking Technique for RF Power Amplifier

Pao-Hua Liao, Yi-Hsun Yang, Yuh-Shyan Hwang
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Abstract

This paper presents a hybrid supply modulator with envelop tracking (ET) technique for radio frequency (RF) power amplifier. The proposed ET technique tracks the envelop signal up to 70 MHz without large distortion and delay, which can reduce heat, enhance battery life and improve the efficiency of the supply modulator affected by high peak-to-average power ratio (PAPR). Indeed, the circuit of the sensing current in the hybrid supply modulator does not use comparators and complex circuits, so it simplifies the circuit, reduces the chip size and lower the power consumption. Consequently, the performance of the proposed hybrid power modulator and compares other works in the literature with good performance, and the frequency bandwidth of the operation signal is 70 MHz. The output voltage range is from 0.45 to 1.35 V with 1.8 V supply voltage, 4.7Ω load resistance, and the load current range is up to 280 mA, The circuit of the hybrid supply modulator with envelop tracking technique has been fabricated in TSMC 0.18 μm CMOS Mixed Signal RF General Purpose MiM Al 1P6M process and the chip area is 1167 μmx 1148 μm,
基于包络跟踪技术的射频功率放大器混合电源调制器
提出了一种基于包络跟踪技术的射频功率放大器混合电源调制器。所提出的ET技术可跟踪70 MHz以内的包络信号,且无大的失真和延迟,可以减少热量,延长电池寿命,提高受峰值平均功率比(PAPR)影响的电源调制器的效率。确实,混合电源调制器中感应电流的电路没有使用比较器和复杂的电路,因此简化了电路,减小了芯片尺寸,降低了功耗。因此,所提出的混合功率调制器的性能与文献中其他作品相比具有较好的性能,工作信号的频率带宽为70 MHz。输出电压范围为0.45 ~ 1.35 V,电源电压为1.8 V,负载电阻为4.7Ω,负载电流范围可达280 mA。采用台积电0.18 μm CMOS混合信号射频通用MiM Al 1P6M工艺制作了包络跟踪混合电源调制器电路,芯片面积为1167 μmx 1148 μm。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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