ANALYSIS AND EXPERIMENTS OF BALL DEFORMATION FOR ULTRA-FINE-PITCH WIRE BONDING

Journal of Electronics Manufacturing Pub Date : 2000-12-01 DOI:10.1142/S0960313100000204

Z. Zhong, K. Goh

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引用次数: 34

Abstract

This paper discusses ultra-fine-pitch bonding on a 50-μm bond-pad-pitch platform using ϕ23-μm gold wire. A technique for the bonding process and the bonding tool design was developed using the finite element method. It was possible to simulate and analyze the variation in the plastic deformation of ball bond when it was subjected to different loading conditions and capillary configurations. The analysis indicated that the critical bonding tool dimensions and bonding process parameters such as free air ball consistency and bonding force played critical roles in reliable bond deformation. A wire diameter of 23 μm with a capillary hole size of 28–30 μm would be robust for a mass production environment. A diameter of 32–33 μm is recommended as the average size of the free air balls for 50-μm bond-pad-pitch bonding using the ϕ23-μm gold wire. Based on the results obtained from the analysis, special bonding tool configurations were designed and fabricated. Actual bonding was performed to further validate the simulation results with experimental bonding responses. Comparison of the simulation results with the experimental data indicated that the actual ball size (38.5 μm) was approximately 3% larger than that (37.4 μm) obtained from the simulation.

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超细节距焊丝焊球变形分析与实验

本文讨论了在50 μm键合垫-间距平台上，利用23 μm金线进行超细间距键合。提出了一种采用有限元方法进行粘接工艺和粘接工具设计的方法。模拟和分析不同加载条件和毛细配置下球键塑性变形的变化是可能的。分析表明，关键的粘接工具尺寸和粘接工艺参数如自由气球浓度和粘接力对可靠的粘接变形起着至关重要的作用。电线直径为23 μm，毛细孔尺寸为28-30 μm，对于大规模生产环境来说是稳定的。当使用φ 50 μm的金线进行键-垫-间距键合时，建议自由气球的平均直径为32 ~ 33 μm。根据分析结果，设计并制作了特殊的粘接工具结构。为了进一步验证仿真结果与实验结果的一致性，进行了实际粘接实验。仿真结果与实验数据的比较表明，实际球尺寸(38.5 μm)比仿真结果(37.4 μm)大约3%。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Journal of Electronics Manufacturing

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