Validation of module assembly physical models

Abstract

Some typical models used in the assembly of electronic modules are presented along with data establishing the validity of these models. Six cases are examined: two cases of PTH/PWB (plated-through-hole/printed wiring board) model validation: SMT (surface mount technology) reliability prediction using the matrix creep method; prediction of creep rupture times of SMT butt joints; PGA (pin grid array) cracking; and prediction of PWB deflection during BON (bed-of-nails) testing.<>