Cost Implications of Large Area MCM Processing

D. Frye, M. Skinner, R. Heistand, P. Garrou, T. Tessier
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引用次数: 16

Abstract

The Envision/spl TM/ cost model has been extended to allow an economic evaluation of Large Area Processing (LAP) techniques to fabricate MCM D and LD substrates. The model is based on the unit operation analysis of the capital, material, utilities and workforce requirements per thin film layer (dielectric and conductor layer pair). Comparisons are readily made between sputtered and plated metallurgy with and without metal barrier layers; and between dry etchable, and photosensitive dielectrics. Sensitivity analysis has been performed on coating tool cost, throughput and efficiency of the coating process and the type of tools and materials used to generate vias. More than a threefold cost differential exists between sow of the manufacturing scenarios, and more than a ten fold cost differential exists between IC MCM based fabrication and LAP MCM fabrication. This model is applicable to LAP MCM-D, MCM-CD and MCM-LD manufacturing.
大面积MCM加工的成本影响
Envision/spl TM/成本模型已经扩展到允许对制造MCM D和LD基板的大面积加工(LAP)技术进行经济评估。该模型基于对每个薄膜层(介电层和导体层对)的资本、材料、公用事业和劳动力需求的单元运行分析。在有和没有金属阻挡层的溅射和电镀冶金之间很容易进行比较;又介于干式蚀刻、光敏电介质之间。对涂层刀具成本、涂层工艺的产量和效率以及用于生成过孔的工具和材料类型进行了敏感性分析。两种制造方案之间存在三倍以上的成本差异,基于IC MCM的制造和LAP MCM制造之间存在十倍以上的成本差异。该模型适用于LAP MCM-D, MCM-CD和MCM-LD制造。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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