Cost Implications of Large Area MCM Processing

Abstract

The Envision/spl TM/ cost model has been extended to allow an economic evaluation of Large Area Processing (LAP) techniques to fabricate MCM D and LD substrates. The model is based on the unit operation analysis of the capital, material, utilities and workforce requirements per thin film layer (dielectric and conductor layer pair). Comparisons are readily made between sputtered and plated metallurgy with and without metal barrier layers; and between dry etchable, and photosensitive dielectrics. Sensitivity analysis has been performed on coating tool cost, throughput and efficiency of the coating process and the type of tools and materials used to generate vias. More than a threefold cost differential exists between sow of the manufacturing scenarios, and more than a ten fold cost differential exists between IC MCM based fabrication and LAP MCM fabrication. This model is applicable to LAP MCM-D, MCM-CD and MCM-LD manufacturing.