Thermal Management of Flip Chips on Printed Circuit Boards

Abstract

The general trend in the automotive electronics industry dictates increased power dissipation on ever shrinking packaged components, giving rise to greater power density. Flip chips on ceramics have long been used for favorable thermal management and reliability. With the drive to cut costs, printed circuit boards are replacing ceramics for many applications, which requires different thermal management techniques. This paper presents some of the techniques that can be used to achieve comparable thermal performance on printed circuit boards.