Thermal characteristic analysis of integrated circuit package design and silicon chip health status evaluation considering the inverter heat source

Abstract

The problem of thermal characterization planning of integrated circuits (ICs) is the key to limiting the further improvement of chip function and performance. However, as a commonly used frequency control device in ICs, inverters are also one of the main factors affecting the thermal characteristics of integrated circuit chips. Their improper packaging methods will increase the burden of thermal characteristic planning schemes. Therefore, this paper establishes the heat transfer model of integrated circuit packaging based on considering the heat source of the inverter and uses the finite element method to simulate and analyze the influence of the inverter on the chip temperature in different mounting areas and under different operating conditions. Based on the model simulation data, the thermal state of the chip was evaluated by a support vector machine (SVM) optimized by the Sparrow Search Algorithm (SSA). The evaluation results show that the optimal package location of the inverter should be as far away from the chip and benign thermally conductive materials as possible, and the computational efficiency and classification accuracy of SSA-SVM are improved by 147.67% and 20%, respectively, compared with traditional SVM.