Building the Path to Ubiquitous Wireless Connectivity, from Materials to Systems

Luis Andia, Yvan Morandini
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Abstract

Wireless systems and applications evolve together with the semiconductor technologies that make them possible. An essential element of such systems is the RF Front End (RFFE). In this paper, selected contributions of engineered substrates to the mobile 5G and Wi-Fi devices RFFE performance are studied. It provides guidance on required substrate evolution needed to address new and emerging challenges associated with next generation of wireless systems.
构建无所不在的无线连接之路,从材料到系统
无线系统和应用与半导体技术一起发展,使它们成为可能。这种系统的一个基本要素是射频前端(RFFE)。本文研究了工程基板对移动5G和Wi-Fi设备RFFE性能的选择贡献。它为解决与下一代无线系统相关的新挑战所需的衬底演变提供了指导。
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