Electrical properties of nitrided SiO/sub 2/ on 6H-SiC by RTP

Hui-feng Li, S. Dimitrijev, H. B. Harrison, D. Sweatman
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Abstract

This paper presents the results of the effect of NO and N/sub 2/O annealing on the electrical characteristics of SiO/sub 2/ grown on the Si-faced n- and p-type 6H SiC by rapid thermal processing (RTP). For n-type 6H-SiC, the as-grown SiO/sub 2/ in pure O/sub 2/ gives near ideal C-V curves. NO annealing has little effect on the C-V curves while N/sub 2/O annealing makes the C-V curves shift to the positive voltage. For p-type 6H-SiC, NO annealing improves the C-V curves greatly. But N/sub 2/O annealing shifts the C-V curves to the negative voltage. Conductance measurements show that NO annealing decreases the interface state density for both n- and p-type 6H-SiC. N/sub 2/O annealing increases the interface state density for n-type 6H-SiC.
氮化SiO/ sub2 /在6H-SiC上的电学性能
本文介绍了NO和N/sub 2/O退火对快速热加工(RTP)在si面N型和p型6H SiC上生长的SiO/sub 2/电学特性的影响。对于n型6H-SiC,纯O/sub - 2/中生长的SiO/sub - 2/给出了接近理想的C-V曲线。NO退火对C-V曲线影响不大,而N/sub 2/O退火使C-V曲线向正电压偏移。对于p型6H-SiC, NO退火能明显改善C-V曲线。但N/sub 2/O退火使C-V曲线向负电压偏移。电导测量表明,NO退火降低了n型和p型6H-SiC的界面态密度。N/sub 2/O退火提高了N型6H-SiC的界面态密度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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