CD-TEM: Characterizing impact of TEM sample preparation on CD metrology

Abstract

Few existing in-line CD metrology techniques can match the sub-surface 3D analytical capability provided by transmission electron microscopy (TEM). Recent developments in sample preparation and analysis have resulted in a fully automated TEM workflow that enables widespread use of TEM for critical dimension metrology ("CD-TEM"). To better understand the precision of the TEM workflow, this study explores the impact of variations in sample preparation (thickness, damage layer, and cut placement) on CD metrology and precision.