{"title":"Novel MEMS Apparatus for in Situ Thermo-Mechanical Tensile Testing of Materials at the Micro- and Nano-Scale","authors":"J. Han, M. Uchic, T. Saif","doi":"10.1109/MEMSYS.2009.4805324","DOIUrl":null,"url":null,"abstract":"We present, for the first time, a MEMS-based test methodology that potentially enables elevated-temperature mechanical tensile testing of nano- and micro-scale samples within a SEM or TEM (T ≫ 500°C). Importantly, the test methodology allows for the samples to be fabricated separately from the MEMS-apparatus, a significant advancement from other test devices developed by some of the present authors [1]. Therefore the test methodology should be applicable to the study of a wide range of materials. Other advancements found in the methodology include a co-fabricated force calibration device, and a built-in thermocouple sensor to measure the stage temperature close to the sample.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMSYS.2009.4805324","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
We present, for the first time, a MEMS-based test methodology that potentially enables elevated-temperature mechanical tensile testing of nano- and micro-scale samples within a SEM or TEM (T ≫ 500°C). Importantly, the test methodology allows for the samples to be fabricated separately from the MEMS-apparatus, a significant advancement from other test devices developed by some of the present authors [1]. Therefore the test methodology should be applicable to the study of a wide range of materials. Other advancements found in the methodology include a co-fabricated force calibration device, and a built-in thermocouple sensor to measure the stage temperature close to the sample.