Direct Chip Attachment (DCA) Packaging of a 2-D Thermal Flow Sensor

Abstract

The design and fabrication of a DCA packaged thermal flow sensor, as well as the simulation and test results were presented in this paper. The fabricated flow sensor was glued to the backside of PCB board with the adhesive, and wire bonded to front side of the PCB through a prefabricated hole, and then the chip was capsulated using thermal insulated resin on the front side. The test results matched well with the predicted value, with an error no more than 8%.