{"title":"Time domain approach for the evaluation of RC delays effects in ULSI interconnect lines","authors":"L. Vendrame, L. Bortesi, M. Biasio, G. Meneghesso","doi":"10.1109/SPI.2005.1500925","DOIUrl":null,"url":null,"abstract":"The evaluation of RC effects in ULSI technology is important both for process development and for accuracy verification of back-end modeling and cad-tools. The paper proposes a new methodology with one possible implementation for the measurement of RC delays in ULSI interconnect lines (DUT). The proposed implementation has been developed at wafer level by means of a mid-complexity test circuit whose working principle is based on the comparison between the RC delay of the DUT and a well-known reference delay generated on-chip.","PeriodicalId":182291,"journal":{"name":"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.","volume":"49 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPI.2005.1500925","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The evaluation of RC effects in ULSI technology is important both for process development and for accuracy verification of back-end modeling and cad-tools. The paper proposes a new methodology with one possible implementation for the measurement of RC delays in ULSI interconnect lines (DUT). The proposed implementation has been developed at wafer level by means of a mid-complexity test circuit whose working principle is based on the comparison between the RC delay of the DUT and a well-known reference delay generated on-chip.