Passive delay-based macromodels for Signal Integrity verification of multi-chip links

A. Chinea, P. Triverio, S. Grivet-Talocia
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引用次数: 5

Abstract

This paper presents a general strategy for the electrical performance assessment of electrically long multi-chip links. A black-box time-domain macromodel is first derived from tabulated frequency responses in scattering form. This model is structured as a combination of ideal delay terms with frequency-dependent rational coefficients. Two passivity enforcement schemes are then presented, enabling safe and reliable transient simulations of the multi-chip link with a standard circuit solver, including nonlinear drivers and receivers.
基于无源延迟的多芯片链路信号完整性验证宏模型
本文提出了电长多芯片链路电性能评估的一般策略。首先从散射形式的频率响应表导出了一个黑盒时域宏模型。该模型结构为理想延迟项与频率相关的有理系数的组合。然后提出了两种无源增强方案,使用标准电路求解器(包括非线性驱动器和接收器)实现了安全可靠的多芯片链路瞬态仿真。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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