Thermoelectric transport properties of porous silicon nanostructure

A. Yamamoto, H. Takazawa, T. Ohta
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引用次数: 16

Abstract

We evaluated the in-plane thermoelectric transport properties of self-supporting porous silicon samples which were prepared through anodization of degenerate silicon wafer. Rapid decrease of both electrical and thermal conductivity were observed alter the anodization. The thermal conductivities decreased by two orders, while the electrical conductivities were three to five orders of magnitude lower than that of initial silicon at room temperature. Increase of Seebeck coefficient was observed for the 69% porous PS sample and the figure of merit was larger than that of initial silicon. It was found that the reduction in electrical conductivity is larger than that of thermal conductivity. Low conductivity of PS indicates localized carriers due to depletion of carrier and strong scattering taking place in residual silicon nanostructure.
多孔硅纳米结构的热电输运性质
研究了简并硅片阳极氧化制备的自支撑多孔硅样品的平面内热电输运性质。在阳极氧化过程中,电导率和导热系数均迅速下降。在室温下,导热系数比初始硅降低了2个数量级,电导率比初始硅降低了3 ~ 5个数量级。多孔度为69%的PS样品的塞贝克系数有所增加,优点值大于初始硅。研究发现,电导率的下降幅度大于导热系数的下降幅度。PS的低电导率表明载流子的局域化是由于载流子的损耗和残余硅纳米结构中发生的强散射。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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