{"title":"Monolithic Complementary Multi-terminal RC-IGBT Chips for Compact Multi-phase Power Converter","authors":"A. Lale, A. Bourennane, F. Richardeau","doi":"10.23919/MIXDES.2018.8436866","DOIUrl":null,"url":null,"abstract":"The paper deals with the monolithic / “on-chip” integration of multi-phase power converters in medium power applications. It focuses on the integration of the power converter within two original multi-terminal complementary substrates (P and N substrates). Interesting advantages can be brought by the integration of the multi-phase converter within only two complementary multi-terminal power chips. These advantages include power chips realization simplification, multi-terminal chips assembly simplification, gate driver circuit simplification and low EMI through the circuit board.","PeriodicalId":349007,"journal":{"name":"2018 25th International Conference \"Mixed Design of Integrated Circuits and System\" (MIXDES)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 25th International Conference \"Mixed Design of Integrated Circuits and System\" (MIXDES)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/MIXDES.2018.8436866","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
The paper deals with the monolithic / “on-chip” integration of multi-phase power converters in medium power applications. It focuses on the integration of the power converter within two original multi-terminal complementary substrates (P and N substrates). Interesting advantages can be brought by the integration of the multi-phase converter within only two complementary multi-terminal power chips. These advantages include power chips realization simplification, multi-terminal chips assembly simplification, gate driver circuit simplification and low EMI through the circuit board.