The Effect of Interfacial Thermal Resistance on A Sub-Interface Crack Under Thermal Loading

Abstract

This work focus on investigating the thermal fracture behavior of a sub-interface crack on the base of the former work[1], in which the bonded materials are assumed to have the same mechanical properties but dissimilar thermal parameters. However, the constituent materials of composites generally are different in both thermal and mechanical performance, the role of mechanical properties of the bonded materials play in the crack thermal fracture may not be simply ignored. Hence this work consider a more general case that the two bonded semi-infinite plates are of both thermally and mechanically difference, in one of which there exists a crack paralleling to the thermally imperfect bonding interface, a remote heat flux is applied. By using an integral transform/integral equation method, the influence of interfacial thermal resistance on the temperature difference along the crack line, the thermal stress intensity factors (TSIFs) and the crack opening/sliding displacements are researched. The results for steel/chrome bi-material combination show that the thermal fracture behavior of the sub-interface crack is significantly influenced by the interfacial thermal resistance and the crack-interface distance..