Nanoprobing Technique using Additional Gate Biasing for Inaccessible Contact Structures

Abstract

The continual reduction of the technology node in IC process technology has prompted Failure Analysis (FA) to develop new IC defect capturing approaches. Nanoprobing is one of numerous FA processes that provides useful and accurate information for locating flaw areas. More advanced probing techniques have been developed as the IC process progresses to aid in the analysis of structures with inaccessible connections, allowing for early failure diagnosis. These probing approaches are provided in this work, together with experiments and case studies, demonstrating how Nanoprobe indirect probe may overcome obstacles in process and IC structures.