{"title":"The properties of LPcvd Si/sub 3/N/sub 4//SiO/sub 2/ film electret based on silicon","authors":"Mingzhou Zhao, Zhiqiang Huang, LinZhuang Sha, Zhen Xu","doi":"10.1109/ISE.1996.578061","DOIUrl":null,"url":null,"abstract":"By means of the technology of LPcvd and thermal oxidation the Si/sub 3/N/sub 4//SiO/sub 2/ double-layer electret film was prepared on different doped silicon wafers. The experimental results show that the Si/sub 3/N/sub 4//SiO/sub 2/ double-layer film possesses a good storage ability of negative charges after modifying the surface with HMDS, and all of the charges were almost trapped in the bulk of upper layer Si/sub 3/N/sub 4/ film. In addition, the TSD spectra of Si/sub 3/N/sub 4//SiO/sub 2/ film were influenced greatly by the differences of the dopants in the silicon wafers.","PeriodicalId":425004,"journal":{"name":"9th International Symposium on Electrets (ISE 9) Proceedings","volume":"59 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-09-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"9th International Symposium on Electrets (ISE 9) Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISE.1996.578061","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
By means of the technology of LPcvd and thermal oxidation the Si/sub 3/N/sub 4//SiO/sub 2/ double-layer electret film was prepared on different doped silicon wafers. The experimental results show that the Si/sub 3/N/sub 4//SiO/sub 2/ double-layer film possesses a good storage ability of negative charges after modifying the surface with HMDS, and all of the charges were almost trapped in the bulk of upper layer Si/sub 3/N/sub 4/ film. In addition, the TSD spectra of Si/sub 3/N/sub 4//SiO/sub 2/ film were influenced greatly by the differences of the dopants in the silicon wafers.