{"title":"Gaas Mixer Diode Burnout Mechanisms at 36-94 GHz","authors":"A. Christou, Y. Anand","doi":"10.1109/IRPS.1980.362930","DOIUrl":null,"url":null,"abstract":"GaAs Schottky barrier diodes fabricated with different high temperature barrier metals were investigated for CW and pulse burnout. The (TiW-Au)-GaAs, (Ti-Mo-Au)-GaAs, and Pd-GaAs diodes, optimized for 36-94 GHz operation were studied in a multi-junction configuation. The burnout mechanism was characterized by a gradual degradation in noise figure. The physical mechanism consisted of a degradation of metal-GaAs interface by the creation of Ga vacancles in the epitaxial layer and a decrease in GaAs mobility. Pulse burnout at X-band consisted of rapid metal punchthrough and catastrophic failure but with a gradual degradation in noise figure. An optimum CW burnout level of 2.0-2.5 watts was obtained with a thermal compression bonded (TiW-Au)-GaAs mixer diode at 36 GHz.","PeriodicalId":270567,"journal":{"name":"18th International Reliability Physics Symposium","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1980-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"18th International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS.1980.362930","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
GaAs Schottky barrier diodes fabricated with different high temperature barrier metals were investigated for CW and pulse burnout. The (TiW-Au)-GaAs, (Ti-Mo-Au)-GaAs, and Pd-GaAs diodes, optimized for 36-94 GHz operation were studied in a multi-junction configuation. The burnout mechanism was characterized by a gradual degradation in noise figure. The physical mechanism consisted of a degradation of metal-GaAs interface by the creation of Ga vacancles in the epitaxial layer and a decrease in GaAs mobility. Pulse burnout at X-band consisted of rapid metal punchthrough and catastrophic failure but with a gradual degradation in noise figure. An optimum CW burnout level of 2.0-2.5 watts was obtained with a thermal compression bonded (TiW-Au)-GaAs mixer diode at 36 GHz.