Foil covered PACkage (FPAC): a new package concept

Abstract

This paper describes the Foil covered PACkage (FPAC) technology developed by Nitto Denko. This concept involves using a thin metal foil on the package. Consequently the package can show very high solder resistance. An improvement of the laser marking, a reduction in the warpage of the package are some of the other advantages of this technology. The concept can also be adapted to provide an EMI shield.