Ultra-thin body MOS device technologies using high mobility channel materials

S. Takagi, S. Kim, M. Yokoyama, W. Kim, R. Zhang, M. Takenaka
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引用次数: 1

Abstract

MOSFETs using channel materials with low effective mass have been regarded as strongly important for obtaining high current drive and low supply voltage CMOS under sub 10 nm regime [1, 2]. From this viewpoint, attentions have recently been paid to III-V and Ge channels. This is because III-V semiconductors have extremely high electron mobility and low electron effective mass and Ge has extremely high hole mobility and low hole effective mass. In addition, ultra-thin body structure is mandatory for MOSFET with future technology nodes for suppressing short channel effects. In this presentation, the critical issues and the present status of ultrathin body III-V/Ge MOSFETs are addressed.
超薄体MOS器件技术采用高迁移率通道材料
使用低有效质量沟道材料的mosfet被认为对于获得低于10nm的高电流驱动和低供电电压CMOS非常重要[1,2]。从这个角度来看,最近关注的是III-V和Ge通道。这是因为III-V半导体具有极高的电子迁移率和低的电子有效质量,而Ge具有极高的空穴迁移率和低的空穴有效质量。此外,超薄的体结构是MOSFET未来技术节点抑制短通道效应的必要条件。在本报告中,讨论了超薄体III-V/Ge mosfet的关键问题和现状。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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