Optimisation of abrupt emitter-base junction for heavily Be-doped InP/In/sub 0.53/Ga/sub 0.47/As heterojunction bipolar transistor

E. Lefebvre, M. Zaknoune, F. Mollot
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Abstract

The optimisation of an abrupt emitter-base n-p junction for an InP/In/sub 0.53/Ga/sub 0.47/As heterojunction bipolar transistor has been carried out for heavily Be-doped In/sub 0.53/Ga/sub 0.47/As, with Be concentration ranging from 4.4 /spl times/ 10/sup 19/ cm/sup -3/ to 1.2 /spl times/ 10/sup 20/ cm/sup -3/. The electrical conductivity continuously increases even for the highest Be concentrations. Beryllium diffusion and segregation are strongly reduced by lowering the MBE growth temperature to 400/spl deg/C and less. Combined with precise adjustment of the thickness of an undoped spacer layer, it leads to high quality emitter-base junctions. Nearly ideal emitter-base I-V characteristics have been obtained for a doping level around 1 /spl times/ 10/sup 20/ cm/sup -3/, allowing ultra-high frequency HBTs with a base width as thin as 20 nm.
高be掺杂InP/In/sub 0.53/Ga/sub 0.47/As异质结双极晶体管发射基突结优化
本文对高Be掺杂In/sub 0.53/Ga/sub 0.47/As的InP/In/ In/sub 0.53/Ga/sub 0.47/As异质结双极晶体管的突变发射基n-p结进行了优化,Be浓度范围为4.4 /spl倍/ 10/sup 19/ cm/sup -3/至1.2 /spl倍/ 10/sup 20/ cm/sup -3/。即使在最高的Be浓度下,电导率也持续增加。将MBE生长温度降低到400℃以下,铍的扩散和偏析明显减少。结合对未掺杂间隔层厚度的精确调整,可获得高质量的发射极-基极结。在掺杂水平约为1 /spl倍/ 10/sup / 20/ cm/sup -3/的情况下,获得了近乎理想的发射基I-V特性,从而实现了基宽薄至20 nm的超高频HBTs。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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