Integrated circuit reliability prediction based on physics-of-failure models in conjunction with field study

A. Hava, J. Qin, J. Bernstein, Y. Bot
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引用次数: 13

Abstract

Microelectronics device reliability has been improving with every generation of technology whereas the density of the circuits continues to double approximately every 18 months. We studied field data gathered from a large fleet of mobile communications products that were deployed over a period of 8 years in order to examine the reliability trend in the field. We extrapolated the expected failure rate for a series of microprocessors and found a significant trend whereby the circuit failure rate increases approximately half the rate of the technology, going up by approximately √2 in that same 18 month period.
基于失效物理模型的集成电路可靠性预测与现场研究
微电子器件的可靠性随着每一代技术的发展而不断提高,而电路的密度大约每18个月就会翻一番。我们研究了从8年来部署的大量移动通信产品中收集的现场数据,以检查现场的可靠性趋势。我们推断了一系列微处理器的预期故障率,并发现了一个显著的趋势,即电路故障率增加了大约一半的技术,在相同的18个月期间增加了大约√2。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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