SiC and GaN power transistors switching energy evaluation in hard and soft switching conditions

Ke Li, Paul L. Evans, Mark C. Johnson
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引用次数: 18

Abstract

SiC and GaN power transistors switching energy are compared in this paper. In order to compare switching energy Esw of the same power rating device, a theoretical analysis is given to compare SiC device conduction loss and switching losses change when device maximal blocking voltage reduces by half. After that, Esw of a 650V GaN-HEMT is measured in hard switching condition and is compared with that of a 1200V SiC-MOSFET and a 650V SiC-MOSFET with the same current rating, in which it is shown that Esw of a GaN-HEMT is smaller than a 1200V SiC-MOSFET, which is smaller than 650V SiC-MOSFET. Following by that, in order to reduce device turn-ON switching energy, a zero voltage switching circuit is used to evaluate all the devices. Device output capacitance stored energy Eoss are measured and turn-OFF switching losses are obtained by subtracting Eoss, which shows that GaN-HEMT is sill better than SiC device in terms of switching losses and 1200V SiC-MOSFET has smaller switching losses than 650V SiC-MOSFET.
SiC和GaN功率晶体管在硬开关和软开关条件下的开关能量评估
本文对SiC和GaN功率晶体管的开关能量进行了比较。为了比较相同额定功率器件的开关能量Esw,对器件最大阻断电压降低一半时SiC器件的导通损耗和开关损耗的变化进行了理论分析。然后,在硬开关条件下测量了650V GaN-HEMT的Esw,并与相同额定值的1200V SiC-MOSFET和650V SiC-MOSFET进行了比较,结果表明,GaN-HEMT的Esw小于1200V SiC-MOSFET,而1200V SiC-MOSFET的Esw小于650V SiC-MOSFET。然后,为了降低器件的导通开关能量,采用零电压开关电路对所有器件进行评估。测量器件输出电容储能损耗,减去损耗得到关断开关损耗,表明GaN-HEMT在开关损耗方面仍优于SiC器件,且1200V SiC- mosfet的开关损耗小于650V SiC- mosfet。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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